Alignment apparatus of the substrate for lcd

ABSTRACT

The present invention discloses an alignment apparatus, including: a table; a plurality of guide pins positioned on a peripheral protion of the table; a determined area defined by the guide pins in the table; a plurality of lift pins positioned in the table and moving from the table to the height of over the guide pins; a plurality of proximity pins located on the table to hold the substrate when the lift pins are descended; a cylinder positioned under the table and driving a plurality of movable arms in a transverse direction; and a plurality of alignment pins extended from the movable arms in a longitudinal direction.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the invention

[0002] The present invention relates to an alignment apparatus for use in a manufacturing process of a liquid crystal display (LCD) device, and more particularly, for the substrate.

[0003] 2. Description of Related Art

[0004] In general, a manufacturing process of the LCD device includes many steps (such as a cleaning process, a layer-depositing process and a developing process) to fabricate various elements on the substrate After the above-mentioned processes drying processes are needed individually. Robot arms move a substrate in each process-to-process stage and then the substrate is aligned into the alignment apparatus.

[0005] A conventional alignment apparatus employed in, a drying process will be explained hereinafter as one example with the accompanying drawings.

[0006]FIG. 1 is a plan view of a conventional alignment apparatus. A substrate 5 is positioned over a table 2 of the alignment apparatus. A couple of guide pins 1 are located on the peripheral portion of the table 2 near each corner of the substrate 5 to set the substrate 5 in the alignment apparatus.

[0007]FIGS. 2A and 2B are cross-sectional views taken, along line II-II of FIG. 1. As shown in FIG. 2A, the substrate 5 is located on the lift pins 3 by the robot arm (not shown). When the lift pins 3 are going down to the table 2 of the alignment apparatus, as shown in FIG. 2B, the substrate 5 is aligned in the determined area defined by the guide pins 1. Proximity pins 4 for holding the substrate above the table 2 is positioned between the substrate 5 and the table 2. The proximity pins 4 have the length of about 0.2 mm from the surface of the table 2. When the substrate 5 is in contact with and positioned on the proximity pins 4 by a descent of the lift pins 3, the substrate 5 becomes dry by a hot-plate (not shown) having a high temperature.

[0008] However, as shown in FIG. 3, when descending the substrate 5 in the conventional alignment apparatus, the substrate 5 can be misaligned owing to the guide pins 1. Namely, the substrate 5 is not positioned properly in the determined area defined by the guide pins 1.

[0009] The reason of the misalignment between the substrate 5 and the table 2 is not only that the dynamic error occurs when the robot arm carries the substrate 5 on the lift pins 3 but also that the lift pins 3 descend the substrate 5 without compensating for the dynamic error. In the case of misalignment, the substrate 5 can be damaged or become stained in its contact surface to the guide pins 1.

SUMMARY OF THE INVENTION

[0010] In order to overcome the problems described above, a preferred embodiment of the present invention provides an alignment apparatus for use in manufacturing process of an LCD device, which has plural alignment pins.

[0011] Another object of the present invention provides an alignment apparatus that prevents a misalignment between the substrate and the table so as to avoid the damage and the inferiority of the substrate.

[0012] In order to achieve the above objects, the preferred embodiment of the present invention provides an alignment apparatus, including: a table; guide means positioned on a peripheral portion of the table; acceptance means surrounded by the guide means; lift means positioned on the table and moving between under the acceptance means and over the end portion of the guide means; transport means carrying a substrate on the lift means when the lift means are projected over the end portion of the guide means; means for shifting the lift means into the acceptance means and for setting the substrate into the acceptance means; and position-compensating means preventing the substrate from being positioned on the guide means.

[0013] The position-compensating means moves through reciprocation by the determined distance in a tranverss direction parallel to the table plane. And the position-compensating means is projected through the table and perpendicular to the table, and is driven by a cylinder. The position-compensating means also moves from the peripheral portion to the edge of the acceptance means to align the substrate when the lift means is positioned over the end portion of the guide means.

[0014] An alignment apparatus, wherein the acceptance means includes the protruded portion on its surface.

[0015] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] For a more complete understanding of the present invention and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

[0017]FIG. 1 is a plan view of a conventional alignment apparatus;

[0018]FIGS. 2A and 2B are cross-sectional views taken along line II-II of FIG. 1 and illustrate an alignment step;

[0019]FIG. 3 is a cross-sectional view illustrating the misalignment of the substrate on the table according to the conventional art;

[0020] FIG., 4 is a plan view of an alignment apparatus according to an embodiment of the present invention;

[0021]FIG. 5 is a cross-sectional view taken line V-V of FIG. 4 and illustrates an operating state of the alignment apparatus according to the embodiment of the present invention; and

[0022]FIG. 6 is a cross-sectional view taken line V-V of FIG. 4 and illustrates another operating state of the alignment apparatus according to the embodiment of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0023] Reference will now be made in detail to the preferred embodiment of the present invention, example of which is illustrated in the accompanying drawings.

[0024]FIG. 4 is a plan view of an alignment apparatus according to an embodiment of the present invention, A couple of guide pins 101 are located on a table 102 of the alignment apparatus at each corner of a determined area 110. The determined area 110 is defined by the guide pins 101 as a central portion of the table and will align a substrate thereinto. And a plurality of the alignment pins 106 is located in peripheral portion of the table 102. The table 102 has a plurality of passages 109 in the peripheral portion thereof; through which the alignment pins 106 can move.

[0025] As shown in FIGS. 5 and 6, proximity pins 104 for holding a substrate 5 above the table 102 is positioned on the table 2 between the substrate 5 and the table 102. The proximity pins 104 have the length of about 0.2 mm and are protruded from the surface of the table 102. The table 102 includes the hot-plate (not shown) having a high temperature. A plurality of lift pins 103 are positioned on the table 102 while holding the substrate 5. The lift pins 103 can move through reciprocation between the inner part of the table 102 and the height of over the guide pins 101 (see FIG. 4). Meanwhile, a cylinder 107 is installed under the table 102 to drive a pluriality of, movable arms 105. And the lower end portions of the alignment pins 106 are perpendicularly connected to the movable arms 105. Thus, the alignment pins 106 can move in a transverse direction through the passages 109 when the cylinder 107 drives the movable arms 105.

[0026] The distance “d” in which the alignment pins 106 can move is defined by the passage 109, i.e., from, the edge 108 of the determined area 110 (see FIG. 4) to the peripheral portion of the table 102. Hence, the reciprocation range of the alignment pins 106 can be defined by the distance “d”.

[0027] Meanwhile, the substrate 5 is located on the lift pins 103 by the robot arm (not shown) when the lift pins 103 are projected from the inner part of the table 102 in a height of over the guide pins 101 (see FIG. 4). If the substrate 5 is misaligned, it can be adjusted into the determined area 110 (see FIG. 4) by the alignment pins 106 which are connected to the movable arms 105 and driven by the cylinder 107.

[0028] As described above, the substrate 5 is pushed onto the lift pins 103 by the alignment pins 106 when the lift pins 103 are in a state of projection. And then the substrate 5 is adjusted on the proximity pins 104 by the descent of the lift pins 103. Thus, the alignment apparatus can set the substrate 5 in the determined area 110 defined by the guide pins 101. The substrate 5 then becomes dry by using the drying process. After the drying process, the lift pins 103 lift up the substrate 5 and the robot arm (not shown) can carry the substrate 5 for another process.

[0029] As described herein before, using the alignment pins of the alignment apparatus according to the preferred embodiment of the present invention, the damage of the substrate caused by the misalignment and the stain in the substrate can be prevented. Accordingly, the manufacturing yields increase.

[0030] While the invention has been particularly shown and described with reference to first preferred embodiment thereof, it will be understood by those skilled in the art that the foregoing and other changes in form and details may be made therein without departing from the spirit and scope of the invention. 

What is claimed is:
 1. An alignment apparatus, comprising: a table; guide means on a peripheral portion of the table; acceptance means surrounded by the guide means; lift means on the table, the lift means moving a lower part of the acceptance means or an upper part of the acceptance means; transport means carrying a substrate on the lift means when the lift means is positioned on an upper part of the guide means; means for shifting the lift means into the lower part of the acceptance means and setting the substrate into the acceptance means; and position-compensating means preventing the substrate from the guide means.
 2. An apparatus of claim 1, wherein the position-compensating means moves in a tranverse direction parallel to the table.
 3. An apparatus of claim 1, wherein the position-compensating means moves an alternation motion.
 4. the apparatus of claim 1, wherein the position-compensating means is projected perpendicular to the table.
 5. The apparatus of claim 1, wherein the position-compensating means is driven by a cylinder.
 6. The apparatus of claim 1, wherein the position-compensating means moves from the peripheral portion to the edge of the acceptance means when the list means is positioned over the end portion of the guide means.
 7. An apparatus of claim 1, wherein the acceptance means includes an protruded portion on the surface.
 8. The apparatus of claim 1, wherein the transport means includes a robot arms.
 9. The apparatus of claim 1, wherein the table includes a hot-plates type.
 10. The apparatus of claim 1, further comprising proximity pins holding the substrate.
 11. The apparatus of claim 10, wherein the proximity pins maintain a gap between the table and the substrate. 